JPH0547481Y2 - - Google Patents

Info

Publication number
JPH0547481Y2
JPH0547481Y2 JP1987070125U JP7012587U JPH0547481Y2 JP H0547481 Y2 JPH0547481 Y2 JP H0547481Y2 JP 1987070125 U JP1987070125 U JP 1987070125U JP 7012587 U JP7012587 U JP 7012587U JP H0547481 Y2 JPH0547481 Y2 JP H0547481Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
light
emitting diodes
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987070125U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63180956U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987070125U priority Critical patent/JPH0547481Y2/ja
Publication of JPS63180956U publication Critical patent/JPS63180956U/ja
Application granted granted Critical
Publication of JPH0547481Y2 publication Critical patent/JPH0547481Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1987070125U 1987-05-13 1987-05-13 Expired - Lifetime JPH0547481Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987070125U JPH0547481Y2 (en]) 1987-05-13 1987-05-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987070125U JPH0547481Y2 (en]) 1987-05-13 1987-05-13

Publications (2)

Publication Number Publication Date
JPS63180956U JPS63180956U (en]) 1988-11-22
JPH0547481Y2 true JPH0547481Y2 (en]) 1993-12-14

Family

ID=30911474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987070125U Expired - Lifetime JPH0547481Y2 (en]) 1987-05-13 1987-05-13

Country Status (1)

Country Link
JP (1) JPH0547481Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061024A (ja) * 2013-09-20 2015-03-30 パナソニック株式会社 発光モジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198491A (ja) * 1983-04-26 1984-11-10 株式会社東芝 発光表示装置
JPS59198492A (ja) * 1983-04-26 1984-11-10 株式会社東芝 発光表示装置
JPS59206873A (ja) * 1983-05-11 1984-11-22 株式会社東芝 発光表示装置
JPS6141295U (ja) * 1984-08-20 1986-03-15 星和電機株式会社 発光ダイオ−ド表示ユニツト
JPH0222889U (en]) * 1988-07-30 1990-02-15

Also Published As

Publication number Publication date
JPS63180956U (en]) 1988-11-22

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